Recently, following preliminary discussions at the CHINAPLAS Shanghai International Exhibition on Plastics and Rubber in late April 2026, the CEO of South Korea’s SUECO ADVANCED MATERIALS Co., Ltd., accompanied by an interpreter, paid a special visit to the headquarters of Jiaozuo Tianyi Technology Co., Ltd. for an on-site inspection and business talks. The purpose of this visit was to gain a deeper understanding of the company’s manufacturing capabilities and to explore potential collaboration on the TYILG740D thermal insulation material, which is designed for use in high-temperature, demanding environments.
2026-06-10
The material standards for Class C insulation systems have, after many years of development, become increasingly refined.
2026-03-27
Upgraded bond for superhard abrasive grinding wheels: polyimide resin enhances grinding performance.
In the field of superhard-material grinding wheels and segments, upgrading the bond is critical for enhancing grinding performance.
2026-03-27
Energy-saving retrofitting of pulp-molding drying equipment is a key direction for reducing costs and improving efficiency in the industry.
2026-03-27
Optimizing the thermal insulation system of rubber flat-plate hot presses is a critical step in enhancing production efficiency and product quality, with precise control of the thermal conductivity coefficient emerging as the technical focal point.
2026-03-27
In the aerospace sector, the research and development of high-temperature-resistant structural materials is accelerating to meet the demands of applications in extreme environments.
2026-03-27
With the continuous strengthening of national requirements for water environment governance, the upgrading and retrofitting of urban wastewater treatment plants has entered an accelerated phase.
2026-03-27
As a flagship high-performance, high-temperature-resistant material, polyimide resin has achieved a breakthrough in its temperature resistance rating, marking China’s technological advancement in the field of high-end materials.
2026-03-22
In the semiconductor packaging industry, the upgrading of mold materials is emerging as a key driver of industrial self-reliance and controllability.
2026-03-22
In recent years, as electronic products have evolved toward greater lightness, compactness, and multifunctionality, the demand for SMT (surface-mount technology) equipment in the electronic PCB soldering sector has continued to grow.
2025-03-10
Over multiple rounds of technological advancement, the thermal insulation materials used in tire vulcanization presses have evolved from traditional asbestos and silicate-based materials to high-performance composite structural materials.
2025-03-10
Yu Public Security Filing No. 41032602000214