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Industry News

Standards for Class C insulation system materials have been refined, and high-temperature-resistant polymer materials are attracting market attention.

The material standards for Class C insulation systems have, after many years of development, become increasingly refined.

2026-03-27

Industry News

Upgraded bond for superhard abrasive grinding wheels: polyimide resin enhances grinding performance.

In the field of superhard-material grinding wheels and segments, upgrading the bond is critical for enhancing grinding performance.

2026-03-27

Industry News

Energy-saving retrofit of pulp-molding drying equipment drives demand for high-temperature-resistant insulation materials.

Energy-saving retrofitting of pulp-molding drying equipment is a key direction for reducing costs and improving efficiency in the industry.

2026-03-27

Industry News

Optimization of the thermal insulation system for rubber flat-plate hot presses: controlling the thermal conductivity has become a key technical focus.

Optimizing the thermal insulation system of rubber flat-plate hot presses is a critical step in enhancing production efficiency and product quality, with precise control of the thermal conductivity coefficient emerging as the technical focal point.

2026-03-27

Industry News

Upgrading and retrofitting urban wastewater treatment is accelerating, leading to a concentrated surge in demand for high-efficiency phosphorus-removal agents.

With the continuous strengthening of national requirements for water environment governance, the upgrading and retrofitting of urban wastewater treatment plants has entered an accelerated phase.

2026-03-27

Industry News

Breakthrough in the temperature resistance grade of polyimide resin: 400°C-grade thermosetting materials now domestically produced.

As a flagship high-performance, high-temperature-resistant material, polyimide resin has achieved a breakthrough in its temperature resistance rating, marking China’s technological advancement in the field of high-end materials.

2026-03-22

Industry News

Semiconductor packaging mold materials are being upgraded, with high-temperature-resistant composite materials accelerating their replacement of imports.

In the semiconductor packaging industry, the upgrading of mold materials is emerging as a key driver of industrial self-reliance and controllability.

2026-03-22

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