From October 28 to 30, 2026, the 5th International Plant Fiber Molding Industry Exhibition (IPFM 2026) will be held at the Tanzhou International Convention and Exhibition Center in Foshan, Guangdong. Tianyi Technology will showcase its specialized thermal insulation materials for plant fiber molding drying equipment at Booth A213 in Hall 1, joining industry peers to explore new pathways for energy conservation, consumption reduction, and green manufacturing.

IPFM is an international flagship event dedicated to the pulp‑molding industry, co‑organized by Packaging Tribe and Meishi Media–Wak Exhibition, and has been held for five consecutive editions. This year’s show features seven signature programs centered on technological innovation, in‑depth development of niche segments, smart‑technology applications, business matchmaking, and premium‑product selection. Concurrently, it hosts forums such as the Pulp‑Molding Egg Tray and Egg Box Industry Innovation Forum and the Paper‑Based Green Packaging Innovation Application Forum. Anchored in South China and reaching out globally, IPFM bridges information flows and commercial connections across the entire value chain.

Our company has been deeply engaged in the field of high‑temperature‑resistant new materials for over two decades and possesses proprietary core technology in polyimide (PI). To address the high‑temperature, high‑humidity operating conditions of plant‑fiber molding and drying equipment, we have specially developed a series of thermal insulation materials covering a wide temperature range—from ambient up to 220°C, 250°C, 300°C, 350°C, and even 400°C—meeting diverse application needs such as dedicated insulation for top and bottom compression, side‑wall thermal insulation, and specialized insulation for transfer mesh frames. These materials exhibit excellent resistance to moisture, superior high‑temperature performance, crack prevention, anti‑spalling properties, and outstanding thermal insulation.

This exhibition marks our company’s continued deepening of expertise in pulp‑molded packaging applications, following our established presence in the rubber and plastics, SMT electronics, and other sectors. During the event, our team will be on hand at Booth A213 in Hall 1, offering product‑selection guidance and thermal‑insulation solution consulting to manufacturers of paper‑based equipment and end‑use product companies, while showcasing physical samples of insulation materials for different temperature zones and demonstrating their real‑world performance.

Tianyi Technology cordially invites friends—both new and longstanding—in the pulp-molding industry to visit Booth A213 in Hall 1 at the Foshan Tanzhou International Convention and Exhibition Center, where you can share insights on thermal insulation and energy efficiency and discuss the future of green manufacturing!