Latent Epoxy Curing Accelerator TYRPH521
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  • Latent Epoxy Curing Accelerator TYRPH521

Latent Epoxy Curing Accelerator TYRPH521

Primarily used in bisphenol A-type epoxy resin/anhydride systems.
It is widely used in the manufacturing of high-performance composite materials, exhibiting excellent thermal resistance and mechanical properties, and is also suitable for producing solid self-lubricating mechanical components that withstand high (or low) temperatures.

Category:

Polyimide (PI) Resin Product Series

Contact phone number:

Mr. Wu: +86-15839187888

Mr. Zhang: +86-13728636252

E-mail:

tyty863@163.com

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Product Details

Product Overview

Primarily used in bisphenol A-type epoxy resin/anhydride systems.

Product Function

1. Above the critical temperature, the system reaction is accelerated, shortening the gelation time; below the critical temperature, the storage life of the system is extended, and the reaction is inhibited.

2. Maintain the cured system’s excellent mechanical and electrical properties.

Application Fields

1. A latent accelerator for anhydride-cured bisphenol A epoxy resins, which can be widely used as a curing accelerator for epoxy mica tapes (such as 5438, 5440-1, and 5440-2) employed in the main insulation materials of large electric motors.
2. A solvent-free impregnation varnish accelerator for acid-cured epoxy systems, which enhances varnish stability and shelf life and improves its electrical performance.
3. Used in epoxy potting systems (insulating components for high-voltage switches in power transmission and transformation equipment, dry-type transformers, and instrument transformers).
4. A curing accelerator for epoxy/phenolic resin systems, epoxy/dihydroxyamine systems, phenolic resin systems, and bismaleimide polyimide resin systems.
5. Latent accelerators for BT resins and cyanate ester/epoxy resins.

Technical Indicators

Product Name Appearance Melting point (°C) Solubility (g/100 g toluene)
TYRPH521 White powder >100>10

Keywords

Polyimide (PI) high-temperature resistant composite material

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Polyimide Resin Powder TYRPC520/520A

Polyimide Resin Powder TYRPC520/520A

TYRPC520/520A polyimide resin powder is one of the advanced matrix resins for composite materials and is widely used in the production of high-performance composites, serving as a replacement for Kerimid 601 polyimide resin.
Latent Epoxy Curing Accelerator TYRPH521

Latent Epoxy Curing Accelerator TYRPH521

Primarily used in bisphenol A-type epoxy resin/anhydride systems.
Polyimide Resin Liquid TYRRC530

Polyimide Resin Liquid TYRRC530

It is an advanced composite matrix resin widely used in the production of high-performance composites, particularly well suited for manufacturing high-temperature-resistant copper-clad laminates and high-temperature-resistant laminated boards, and can serve as a replacement for Kerimid 701A polyimide resin.
720 Series (Room Temperature to 220°C)

720 Series (Room Temperature to 220°C)

Low Cost | Economical | Innovative Design | Wide-Scale Application
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Telephone:

+86-391-8865551

Contact phone number:

Mr. Wu: +86-15839187888

Mr. Zhang: +86-13728636252

Email:

tyty863@163.com

Address:

No. 1758, Nanhai Road, Demonstration Zone, Jiaozuo City, Henan Province

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