Focused on the field of high-temperature-resistant polyimide (PI) composite materials.
Polyimide Resin Powder TYRPC520/520A
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Product Details
Product Overview
TYRPC520/520A polyimide resin powder is one of the advanced matrix resins for composite materials and is widely used in the production of high-performance composites, serving as a replacement for Kerimid 601 polyimide resin. It is primarily employed as a binder in grinding wheels made of diamond and cubic boron nitride, as well as in friction materials, and as the base resin for high-temperature-resistant molded components. This resin exhibits excellent thermal stability and mechanical properties and is also suitable for fabricating high- (and low-) temperature-resistant solid self-lubricating mechanical parts. When dissolved in organic solvents such as DMF to form a resin solution with a specified solids content, it can be used to prepare fiber-reinforced prepregs—such as glass-fiber-reinforced and carbon-fiber-reinforced preforms—and has found extensive application in the field of high-temperature-resistant resin-matrix composites.
Product Chemical Description
It is a polyimide resin system based on bismaleimide.
Product Features
1. High glass transition temperature and thermal stability.
2. Excellent mechanical and electrical properties.
3. Excellent storage stability.
Product Usage
After thorough mixing with various powdered materials, the mixture is subjected to mold pressing under specified conditions. It is then dissolved in organic solvents (such as DMF) to prepare a resin solution with a defined solid content, which is used to produce fiber-reinforced prepregs (e.g., glass-fiber-reinforced or carbon-fiber-reinforced) for laminated composites. Alternatively, by dissolving the material in organic solvents (such as DMF) to obtain a resin solution of a specified concentration and subsequently blending it with epoxy resins in varying ratios as required, a range of novel epoxy resin systems with different thermal-resistance grades can be formulated to meet the thermal-performance requirements of various composite materials and electrical insulation materials.
Technical Indicators
| Appearance | Melting point (°C) | Particle size (mesh) | Gelation time (seconds, 171°C) |
|---|---|---|---|
| Pale yellow powder | 80~110 | 200~1000 | 200~260 |
Keywords
Polyimide (PI) high-temperature resistant composite material
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