Focused on the field of high-temperature-resistant polyimide (PI) composite materials.
TYECF601 Antistatic, Deformation-Resistant Composite Material (Intermediate Synthetic Stone)
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Product Details
Product Positioning
Intermediate Synthetic Stone Specifically Designed for SMT Processes
Material Properties and Applicable Functions
This composite material, made from high-temperature-resistant resins and electronic-grade glass fibers, is used in the electronics industry for manufacturing PCBs, as well as for medium- and large-scale wave-soldering fixtures and small reflow-soldering fixtures. It outperforms conventional synthetic stone in overall performance, offering excellent resistance to corrosion and deformation, preventing delamination and contamination, ensuring precise soldering, and delivering stable soldering quality. It is easy to process, produces no burrs, is resistant to delamination, contains no ingredients harmful to human health, emits no unpleasant odors, does not cause skin irritation, and complies with EU EHS standards as well as lead-free RoHS certification.
Technical Indicators
| Indicator Item | Value / Parameter |
|---|---|
| Color | Black |
| Density (g/cm³) | 1.9 |
| Surface Resistance (Ω) | 10⁵-10⁹ |
| Thermal conductivity (W/m·K) | 0.48 |
| Standard Operating Temperature (℃) | 260-290 |
| Maximum Operating Temperature (℃) | 290 |
| Corrosion resistance | Strong |
| Skin Irritancy | None |
| Standard dimensions (mm) | 1220x2440 |
| Standard Thickness (mm) | 3, 4, 5, 6, 8, 10, 12, 15 |
| Allowable Thickness Tolerance (mm) | 0~+0.15 |
| Permissible flatness tolerance (350 mm × 350 mm) | 0.25 |
Keywords
Polyimide (PI) high-temperature resistant composite material
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