Focused on the field of high-temperature-resistant polyimide (PI) composite materials.
Semiconductor packaging mold materials are being upgraded, with high-temperature-resistant composite materials accelerating their replacement of imports.
Mar 22,2026
In the semiconductor packaging sector, the upgrading of mold materials is emerging as a key driver of industrial self-reliance and controllability. As chip performance continues to advance, conventional packaging materials are increasingly unable to meet the demands of extreme operating conditions such as high temperatures and high stress levels, making high-temperature-resistant composite materials the core focus for replacing imports. These materials achieve breakthroughs in thermal stability, mechanical properties, and flame retardancy through the synergistic design of reinforcing phases—such as carbon fibers and ceramic particles—and specialized resin matrices. For example, carbon-fiber-reinforced epoxy composites can maintain structural integrity even at 520°C, with a residual char yield exceeding 40%, effectively inhibiting heat transfer; meanwhile, a flame-retardant system modified with nano-layered silicates raises the material’s limiting oxygen index to 32% and achieves a UL-94 V-0 rating for vertical burning, thereby satisfying the requirements for applications in enclosed spaces.
Domestic enterprises are accelerating technological breakthroughs, with some products already achieving import substitution. For example, Debang Technology has developed the PTIM16374 material, which, through optimization of its three-dimensional cross-linking network structure, reduces the interfacial thermal resistance between the chip and the heat sink cover by 30%, thereby significantly enhancing thermal dissipation efficiency. Meanwhile, Huahai Chengke has launched granular molding compound (GMC) and underfill molding compound (MUF), both of which have reached internationally advanced levels in high-temperature resistance and mechanical strength and are now being used in high-end applications such as 5G base stations and AI computing. With the key support provided under the 14th Five-Year Plan for the packaging of third-generation semiconductor materials, domestically produced high-temperature-resistant composite materials are transitioning from the laboratory to large-scale production, thereby providing a solid guarantee for the security of the semiconductor industry chain.
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